Semtech Corporation announces the EClamp𥚕xP family of devices designed to protect against the increased risk of electrostatic discharge (ESD) and increased levels of electromagnetic interference (EMI) and radio frequency interference (RFI) in 3G and CDMA phones. The EClamp237xP devices feature IEC-standard levels of ESD protection, low capacitance and resistance and a rugged package that consolidates more than 32 discrete components to help conserve board space in these space-constrained applications. The EClamp237xP family includes the four-line EClamp2374P, the six-line EClamp2376P and the eight-line EClamp2378P. The devices feature a TVS diode on each line for ESD protection and a resistor-capacitor network for EMI/RFI filtering.
Semtech Corporation
Semtech Corp.
http://www.semtech.com
