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Aries Electronics offers a new ball grid array (BGA) to BGA adapter which resolves soldering issues that arise when BGA devices with RoHS-compliant solder balls are assembled with other devices whose connections are not lead-free. This adapter solves solder joint reliability problems that occur when the lower reflow temperatures used for standard tin-lead eutectic solder balls cause the incomplete reflow of the lead-free solder balls. The lower temperatures may also be required to avoid damaging the PCB and other components on the board.

Aries Electronics