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Manncorp introduces its System 855 bench-top rework station with process control and precision features of larger reflow ovens. Its profiling adjustments include push-button settings for temperature, air flow volume and duration, allowing the low-volume user to replicate recommendations of solder paste manufacturers. When activated, the unit proceeds automatically through its three preheating zones and two reflow zones before auto shut-off when the cycle is completed. Up to 10 profiles can be stored in the system memory. The system’s temperature range of up to 350°C meets the thermal demands of lead-free processing. Accuracy is ensured by an included external thermocouple on the PCB, while an adjustable ceramic under-heater acclimates the PCB to rising temperatures, preventing board warpage.


www.manncorp.com
800-745-6266

Manncorp
http://www.manncorp.com