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Vishay Intertechnology, Inc. announces that it is making all of its FunctionPAK® DC/DC converters and current control modules available in a new surface-mount adaptor board configuration to support engineering prototype assembly. While most production operations can handle the standard FunctionPAK surface-mount BGA configuration, the new SM versions of the FunctionPAK devices will facilitate the assembly process for any engineering lab that finds it difficult to handle the BGA configuration in its prototype assembly lab. The "SM" versions are the second of two FunctionPAK options expressly intended to streamline the design prototype process. Also available is a "PI" series of plug-in versions of all devices in the FunctionPAK family, which can be plugged easily into a "bread board" for prototyping and testing. The series devices offer a 0.1-in. grid pin configuration for soldering directly into the circuit board and a standard socket for the added flexibility of switching different modules in and out of the circuit.

Vishay Intertechnology, Inc.