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Kyocera announces an open tooled, high performance 28-lead QLFP (Quad-Lead-Flat-Package) for millimeter-wave frequencies. This surface mountable package features a Cu/Mo heat sink, kovar seal ring, gull wing leads and both differential and single-ended RF ports. It has good electrical performance characteristics up to 40 GHz, and the cavity will fit most 3 or 4 mm devices. The Cu/Mo heat sink will support most power device applications and hermeticity can be achieved with either a combo lid or seam sealing to the kovar seal ring. Specific applications for this package include power amplifiers, transimpedance amplifiers, differential amplifiers, low noise amplifiers, modulator drivers or mm wave mixers.

Kyocera America, Inc.

Kyocera America Inc Microelectronics Div
8611 Balboa Ave
San Diego, CA, 92123