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STATS ChipPAC Ltd. Introduces a new flip chip technology that offers a significant cost savings over standard flip chip packages with price points well below wire bond packages. STATS ChipPAC's low cost flip chip technology features an innovative routing efficient interconnection structure and a simplified substrate technology design coupled with improvements in assembly technology such as a cost effective mold underfill process. The company has achieved this significant cost reduction with its low cost flip chip technology, essentially offering semiconductor companies the opportunity to have flip chip technology at price points below wire bond packaging. Rather than focusing on incremental changes in individual materials or processes, STATS ChipPAC took a comprehensive approach to reengineering the package structure and key processes to design the cost out of each element of flip chip technology, from substrate design to bump and the assembly process.

Wireless Design & Development