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The ability to reduce the size of today's sophisticated electronic components has created success in applications that we thought not possible just a few years ago. Medical device technologies, as one example, have certainly benefited from the advancements made in electronics miniaturization, thus enhancing our overall healthcare experience

Q: What is the most effective approach to achieving device miniaturization in wireless applications?

Switches Play a part in Device Miniaturization

By David Webber, Director of Product Management, C&K Components

Achieving device miniaturization is largely dependant upon the components that make up the end product. Switches play a key role in this, particularly in terms of materials selection, functionality and utilizing proven designs.

Switch materials that interface with the operator and those in the actual contact mechanism can be re-evaluated and altered to conform to miniaturization standards without compromising performance, reliability, lifespan or robustness. Sealing is typically required in harsh environments associated with automated assembly processes and other demanding applications, yet it is a continual challenge to accomplish due to the increasingly small size of the components. Upgrading materials to withstand higher temperature processes allows for implementation into harsh environments, while also meeting the size constraints for miniaturized, portable use.

Increasing the mounting versatility of a component can also aid in device miniaturization. Finally, by using an existing, proven design and reducing the size of all parts so they are proportionally smaller, you don't have to reinvent a proven design, yet your size constraints are met. For example, we offer a miniature toggle switch for medical equipment and instrumentation. Due to industry demands for more compact devices, along with the proven success of this component, we took the design and reduced its size to create the subminiature version, thus meeting an increasing number of customers' demands.

Component Miniaturization Empowers End Product Miniaturization

By Tom Donofrio, Marketing Manager, Central Semiconductor Corporation

Miniaturization of end products has always been the driver for the development of new components. In the area of packaged discrete devices, the improvements in wafer manufacturing technology has driven further miniaturization beyond the physical limitations identified in the latest design cycle. Packaging improvements and assembly technology has combined with the wafer/chip advances to produce yet another generation of tiny discrete devices. The surface mount SOT-923 package is an excellent example. Utilizing approximately 1.1 mm x 0.6 mm of board space and a profile height of less than 0.41 mm, the latest family of discrete semiconductors will certainly provide designers with further opportunities to reduce the size of their end products.

Another reason the development of the latest tiny discrete devices are now possible is the efficiency of the chip characteristics and performance in conjunction with the lower voltage and current requirement of portable hand-held products. In addition, the improved thermal characteristics of the new TLM (DFN) packages provide designers with a space savings without giving up too much power dissipation that is typically associated with the smaller SOT packages.

It is apparent that the evolution in packaged discrete devices will continue with further miniaturization, even in the face of the traditional prophecy claiming the end of the discrete due to integration of its functionality into a single silicon wafer.


Wireless Design & Development