11th Annual KGD Packaging and Test Workshop
Now in its 11th year, the KGD Packaging and Test Workshop has become the
leading source for the latest information on test, assembly,
manufacturing, and business issues for semiconductor die products. The
2004 Workshop will "Focus on Final Manufacturing" by spotlighting
technologies that are emerging today to support the market demands for
stacked packages, wafer level packages, and bumped or bare die.
The 3-day workshop will again feature innovative technical sessions,
free pre-workshop tutorials, and an exhibit of world-class materials and
equipment suppliers.Technical sessions and tutorials will focus on
topics such as wafer thinning, probe testing, die handling, wirebonding,
high density substrate fabrication, package stacking, SiP testing of
stacked packages containing logic, memory and rf chips.
http://www.napakgd.com
Wireless Design & Development
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