Materials >
Materials
>
|
| |
EMC Screened Version 19” Rack Cases
Wireless Design & Development Advantage Business Media, April-11
|
Enclosure Manufacturer Thinks Out of the Box
Wireless Design & Development Advantage Business Media, April-11
|
Fast-Curing Conformal Coating Features Superior Component and Sharp Lead Coverage
Dymax Corporation, April-11
|
Multi-Board Terminal-Block Plastic Boxes Have Space for Three Circuit Boards
Bud Industries, Inc., April-11
|
New Phase Change Material Expands Company’s Thermal Interface Materials Product Line
Laird Technologies, April-11
|
Non-Metallic Enclosures Meet Need for Satellite Communication Use
Wireless Design & Development Advantage Business Media, April-11
|
Robust System Protects Connector Base Metals and Equipment Ports from Environment Pollutants
Wireless Design & Development Advantage Business Media, March-11
|
10G and 40G ATCA® Platforms Updated for Telecom Equipment Manufacturers (TEMs)
Kontron, February-11
|
Bud Industries Announces Electronics Enclosures
for Medical Applications
Bud Industries, Inc., February-11
|
Conduction-Cooled 1/2 ATR Box with 6-slot 3U VPX Backplane
Elma Electronic, February-11
|
Elma Bustronic Offers CompactPCI PlusIO Backplanes
Elma Electronic, February-11
|
Enclosure Features Double Channel Sealing System that Provides EMI/RFI Protection for up to Half the Cost
Bud Industries, Inc., February-11
|
Schreiner ProSecure Introduces new Covert Security Feature for Proof of Authenticity
Wireless Design & Development Advantage Business Media, February-11
|
Engineered PTFE Cables for Industrial, Aerospace and Semiconductor Markets
W.L. Gore & Associates Electronic Products Division, January-11
|
High Temperature Resistant, Toughened
Structural Adhesive Cures at Room Temperature
Master Bond, Inc., January-11
|
Light-Curable Adhesive for Multiple Substrates Has Built-In Cure Indicator
Dymax Corporation, January-11
|
6U VPX Load Board Designed for Conduction Cooled Chassis
Elma Electronic, December-10
|
Chip-Scale Package Options Target Space-Constrained Sports, Fitness, and Health Applications
Nordic Semiconductor ASA, December-10
|
Elma’s StyleBox Modular Enclosure Now Offers Recessed EMC Mounting
Elma Electronic, December-10
|
Endwave Develops Enhanced QFN Packages to 50 GHz
Endwave Corp., December-10
|
Combination of Materials, Fabrication and Test Expertise Deliver LCP Laminates with Exceptional Performance and Proven Reliability
Endicott Interconnect Technologies, Inc, November-10
|
Porous Copper Material Will Transform Cooling Systems and Enable Faster Processing Clock Speeds
Wireless Design & Development Advantage Business Media, November-10
|
Rogers to Display Advanced Materials for Defense Applications at DMC 2010
Rogers Corporation Advanced Circuit Materials, November-10
|
Rugged Blade System Delivers High-Performance Computing in Harsh Environments during Empire Challenge 10
Tracewell Systems Inc., November-10
|
Dual Cool™ Package Answers the Need for Higher Power Density in DC-DC Designs
Fairchild Semiconductor, October-10
|
Fan Tray Reliably Keeps 19-inch Rack Cool Using Digital Temperature Controller
Bud Industries, Inc., October-10
|
Patent Awarded to DYMAX Corporation for Innovative See-Cure Technology
Dymax Corporation, October-10
|
Bustronic Develops New VXS Backplanes with Ethernet Control Channel
Elma Electronic, September-10
|
Conformal Coating Mitigates Tin Whisker Formation
Dymax Corporation, September-10
|
Environment-Friendly Material Options
for the CPLD Family Now Available
Lattice Semiconductor Corp., September-10
|
High-Resolution Wide-Aspect 5.0” TFT
Dymax Corporation, September-10
|
NAND BGA Package Provides Up to 16 GByte Solid State Storage
Microsemi Corporation, September-10
|
New Corner Design Optimizes Part Rigidity for Improved Shielding Performance
Laird Technologies, September-10
|
Optima Announces New Cabinet Enclosure for Broadcast and Data Center Applications
Elma Electronic, September-10
|
Bustronic Releases 3U VPX Backplane with RF Connectors
Elma Electronic, August-10
|
Combined Laminates Provide Matched 6.15-Dk Multilayer System Solution
Rogers Corporation Advanced Circuit Materials, August-10
|
Load Board Helps Confirm Chassis Meets Power Specs
Elma Electronic, August-10
|
Mass Storage Mezzanine Offers Fast
Secure Erasure and Write Protection
Elma Electronic, August-10
|
NEMA-rated Waterproof Plastic Enclosures Are Ideal for Wet and Harsh Environments
Bud Industries, Inc., August-10
|
Thermally Conductive,
Low Viscosity Epoxy Features
Cryogenic Serviceability
Master Bond, Inc., August-10
|
Dual Face Sloping-Front Enclosures Range Extended
Wireless Design & Development Advantage Business Media, July-10
|
Electronics Enclosures Solutions for Alternative Energy Applications
Bud Industries, Inc., July-10
|
Rogers Teams New RO4460™ Prepreg With RO4360™ Laminates for Matched 6.15-Dk Multilayer System Solution
Rogers Corporation Advanced Circuit Materials, July-10
|
Compact Enclosure Family Provides a Flexible Modular Design
Elma Electronic, April-10
|
Next Generation PoP for Processor and Memory Stacking
Tessera, April-10
|
Three Ways to Create Eco-Friendly, Financially-Beneficial Packaging
Brightstar, April-10
|
Antenna Grade Laminates Help Minimize Signal Loss
Rogers Corporation Advanced Circuit Materials, February-10
|
NXP’s QUBiC4X Technology Enables Development of New Era of Connected Radio Frequency Devices
NXP Seminconductors nxpsemiconductors, June-09
|
ATCA backplane Now Features Standard MicroTCA Connectors
Elma Electronic, May-09
|
Complex PC Board Assemblies Provide Solutions
Endicott Interconnect Technologies, Inc, May-09
|
Lead-Free Thermal Management Material for Semiconductors
Honeywell Aerospace Electronics Systems, May-09
|
Mobile Multimedia Applications Require New Memory Architectures
Amkor Technology, Inc., May-09
|
New Flip Chip Technology Offers Significant Cost Savings Over Standard Flip Chip Packages
Wireless Design & Development Advantage Business Media, May-09
|
System-in-Package Solution for Automotive LIN Networking Applications
Atmel Corporation, May-09
|
TEMs Can Upgrade Existing Systems and Stay Within 200 W Power Envelope
Kontron, May-09
|
Ball Grid Array Reduces Memory Footprint
Ramtron International Corporation, March-09
|
MicroTCA for Mil/Aero Emerges
Emerson Network Power - Connectivity Solutions, March-09
|
Thermally Conductive Adhesives Dissipate Heat
Cotronics Corp., March-09
|
Silicone-Free Interface Material Provides High Thermal Conductivity
MH&W International Corp, February-09
|
Advanced RFID Tag Simplifies Attachment Process Ensuring Greater Quality Control
Murata Electronics N.A., Inc. North America, November-08
|
Advanced RFID Tag Simplifies Attachment Process Ensuring Greater Quality Control
Murata Electronics N.A., Inc. North America, November-08
|
Electrically Conductive Film for Use in Medical Devices
Adhesives Research, November-08
|
Advanced RFID Tag Simplifies Attachment Process Ensuring Greater Quality Control
Murata Electronics N.A., Inc. North America, October-08
|
Crystal Package Yields Low Resistance
Tellurian Technologies, September-08
|
Epoxy Adhesive Cures Rapidly at Room Temperature
Master Bond, Inc., September-08
|
Packaging Performs in X through K Band Frequencies
AdTech Ceramics, September-08
|
Wi-Fi/WiMax Triplexer Uses Embedded Passive Components
Jacket Micro Devices, September-08
|
Enclosure Receives Zone 1 Approval
Extronics, August-08
|
Enclosure Targets Industrial Wireless Installations
Phoenix Contact, August-08
|
Harnessing the Benefits of Adaptive RF Tuning
Paratek Microwave Inc., August-08
|
Thermal Pad Increases Thermal Conductivity
Laird Technologies, August-08
|
Boxes Feature Dual-Channel Gasket Construction
Bud Industries, Inc., July-08
|
Beryllium Oxide Achieves Higher Thermal Conductivity
Brush Ceramic Products, June-08
|
Membrane Media Increases Thermal Performance
W.L. Gore & Associates Electronic Products Division, June-08
|
Membrane Media Increases Thermal Performance
W.L. Gore & Associates Electronic Products Division, June-08
|
New Process Delivers Significant Miniaturization
Avago Technologies, June-08
|
New Process Delivers Significant Miniaturization
Avago Technologies, June-08
|
The Diagnosis for MicroTCA...
Emerson Network Power - Connectivity Solutions, June-08
|
Intel-based ATCA CPU Blade Offers Performance, Integration and Flexibility
Adlink Technology, Inc., May-08
|
Silicone Gaskets and Pads Feature Acrylic Adhesive Backings
Stockwell Elastomerics, Inc., May-08
|
System Designed for Multiple Industries
Emerson Network Power - Connectivity Solutions, May-08
|
Thermally Conductive Polymers for Heat Sinks
Cool Polymers, Inc., May-08
|
Integrated Substrate Packages for Wireless Applications
Jacket Micro Devices, April-08
|
Silicone Gaskets and Pads Feature Acrylic Adhesive Backings
Stockwell Elastomerics, Inc., April-08
|
Innovation in Package-Level EMI/RF Shielding
RF Micro Devices, Inc., March-08
|
Solder/Rework Station Removes or Resolders Components
Manncorp, January-08
|
Soldering System Delivers High Power with Impressive Thermal Control
OK International, January-08
|
Ultra-miniature Quartz Crystal
MMD Components (Monitor & Quartztek), December-07
|
Advanced Circuit Materials
Rogers Corporation Advanced Circuit Materials, November-07
|
Series of Portable Aluminum Instrument Cases
Bud Industries, Inc., November-07
|
Uni-Matic Epoxy
Multi-Seals, November-07
|
Hermetic Microelectronic Packages
CPS Technology Solutions, Inc, September-07
|
PTFE-based Coreless Semiconductor Package
Endicott Interconnect Technologies, Inc, August-07
|
Alumina Ceramic Components
Morgan Advanced Ceramics (MAC), May-07
|
Express Smart Chassis Series
Geotest - Marvin Test Systems, Inc., April-07
|
Epoxy Resin Compound
Master Bond, Inc., March-07
|
Plastic Hand-Held Enclosures
Polycase, February-07
|
AT-Cut SMD Crystals
NDK America, Inc. Subsidiary of Nihon Dempa Kogyo Co., Ltd., January-07
|
Grid Array
Aries Electronics, October-06
|
Automatic Die Bonder
Palomar Technologies, Inc., September-06
|
Protective Vent
W.L. Gore & Associates Electronic Products Division, September-06
|
Semiconductor Hermetic Package
StratEdge, September-06
|
Ball Grid Array Package
TT electronics IRC Advanced Film Division, August-06
|
High Frequency Circuit Material
Rogers Corporation Advanced Circuit Materials, August-06
|
Liquid Lens Mini Imaging System
Rogers Corporation Advanced Circuit Materials, August-06
|
Soft Seal Foams
Rogers Corporation Advanced Circuit Materials, August-06
|
Epoxy Dispenser
Wireless Design & Development Advantage Business Media, May-06
|
Epoxy Adhesive
Master Bond, Inc., April-06
|
Polished Ceramic Substrates
TT electronics IRC Advanced Film Division, April-06
|
Polished Ceramic Substrates
TT electronics IRC Advanced Film Division, March-06
|
RF Isolation Enclosures
Azimuth, January-06
|
Substrate Material Keeps Components Cool
TT electronics IRC Advanced Film Division, January-06
|
Two-leaded Plastic Package
Tyco Electronics M/Acom, January-06
|
ESD Protection Device
Semtech Corp., December-05
|
Packageless Transceiver
Endwave Corp., December-05
|
Leadless SMT Ceramic Packages for Direct PCB Mount
Remtec, November-05
|
CFD Sofware
Daat Research Corp., October-05
|
LCP-based Circuit Materials
Rogers Corporation Advanced Circuit Materials, October-05
|
Lead-free Wafer Bumping Services
IC Interconnect, October-05
|
Singulated Substrate Process
DEK International GmbH, October-05
|
Splayed Pin Fin Heat Sinks
Cool Innovations, September-05
|
2 Character LCD
CSTN Canada, Inc., August-05
|
PCB Plotters
LPKF Laser & Electronics, August-05
|
Urethane Foam
Rogers Corporation Advanced Circuit Materials, July-05
|
Array Matrices
Atmel Corporation, June-05
|
Circuit Materials
Rogers Corporation Advanced Circuit Materials, June-05
|
Dielectric Materials
W. L. Gore & Associates, Inc., June-05
|
Hermetic Packaging
StratEdge, June-05
|
28-Lead QLFP Package
Kyocera America Inc Microelectronics Div, May-05
|
Electrical Conduit
Electri-Flex Company, May-05
|
Circuit Materials
Rogers Corporation Advanced Circuit Materials, March-05
|
Multilayer Cofired Ceramic Design Guide
Advanced Technical Ceramics Company, February-05
|
Crystal Packaging Technology
Fox Electronics, January-05
|
Piezoelectric and Dielectric Ceramics
Morgan Technical Ceramics Inc., December-04
|
BiCMOS Technology
X-FAB Semiconductor Foundries AG, November-04
|
Silicon Wafers
Chartered Semiconductor Manufacturing Ltd., November-04
|
Ceramic Technology
Murata Electronics N.A., Inc. North America, September-04
|
Foundry Design Kits
TriQuint Semiconductor, Inc., September-04
|
IC Packages
National Semiconductor Corporation, September-04
|
LDMOS Packages
Kyocera America Inc Microelectronics Div, September-04
|
Manufacturing and Design Brochure
Pentair Electronic Packaging Co., September-04
|
4-Pad Crystal
ILSI America, August-04
|
Ceramic Technology
Murata Electronics N.A., Inc. North America, August-04
|
Circuit Materials
Rogers Corporation Advanced Circuit Materials, August-04
|
EMI Gasket and Shielding Line
Spectrum Control, Inc., August-04
|
Foundry Design Kits
TriQuint Semiconductor, Inc., August-04
|
IC Packages
National Semiconductor Corporation, August-04
|
LDMOS Packages
Kyocera America Inc Microelectronics Div, August-04
|
Manufacturing and Design Brochure
Pentair Electronic Packaging Co., August-04
|
Source Assembly
TRAK Microwave Corporation, August-04
|
Packaging Solutions
Minicaps, July-04
|
|
|
