Wireless Design & Development

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Using Next-Generation Non-Stationary Noise Suppression to Enhance...
LTE Femtocell Roadmap from Concept to Reality
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Other Items from Agilent EEsof EDA

Electronic Measurement Software Supported by Foundry and Component Vendors
March 2011
Industry’s First LTE-Advanced Signal Generation, Analysis Solutions
February 2011
Software Automates In-Circuit Test Coverage Reports
December 2010
Agilent Software Automates STMicroelectronics' Device Modeling On-Wafer Measurements
November 2010
IC-CAP WaferPro Software for Automating Complex Device Modeling Applications
August 2010
New LTE Applications Target 4G System-Level Designers
April 2010
New LTE Applications Target 4G System-Level Designers
March 2010
Process Design Kits Accelerate Time-to-Market for High-Speed IC Development
June 2009
Integrated, Efficient Flow Reduces Risk, Speeds Power Amplifier Module Design
May 2009
ADS Software Features Co-Design Capabilities
March 2009
RF EDA Software Combines Simulation Capabilities with Ease-of-Design
July 2002


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Controller Kits Tap Into High-speed PCIe Bus Two new controller kits for the ScanWorks platform for embedded instruments from ASSET InterTech can, according to the company accelerate test throughput by plugging into the high-speed PCI Express (PCIe) bus in the personal computer where ScanWorks is running.  


Power Modules Meet Increased Power and Energy Monitoring Demands Ericsson has announced a new series of Power Interface Modules that save board space for core processing functions and enable system architects to design equipment with energy monitoring features, enabling the use of optimization algorithms to reduce overall board power consumption.  


Industry’s First SAR ADC with SPICE Model Texas Instruments Incorporated today introduced a successive-approximation-register (SAR) analog-to-digital converter (ADC) with a downloadable TINA-TI SPICE model, enabling system designers to simulate and characterize the full analog signal chain in software for the first time.  












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